Dicing (Kiru) - Blade Dicing
Regarding the market’s demands for ever smaller devices, our dicing processes do not only reduce production costs for our customers, but also meet the end consumer’s needs. Different factors like thickness, wafer size, material, dicing streets or additional processing determine dicing parameters. DGS supports finding the most efficient option for any demand. Our dicing processes are easily adaptable to any size, material and shape of packaging such as rectangles or partial wafers. With DISCO dicing saws and dicing blades equipment we perform unrivaled accuracy results when it comes to wafer dicing. Beside blade dicing we offer several laser dicing solutions.
Single Cut
Using the Single Cut, the workpiece is severed by a single full cut in only one process step. It is performed by Disco’s single or dual spindle dicing saws to reduce the process time. Best blade dicing parameters are identified by DISCO HI-TEC Europe.
Step Cut
The Step Cut is performed by Disco’s dual spindle dicing saws. Each spindle is equipped with a different dicing blade. This process is a solution to many problems currently faced (e.g. backside chipping) and can be integral in achieving an acceptable process for many different applications and wafer singulation.
Bevel Cut
The Bevel Cut is a special step cut and is executed using a V-shaped dicing blade that produces a chamfer on the top side of the die, which eliminates the sharp corner and increases die strength when performing wafer dicing.
Pattern Grooving
“Grooving” is a dicing technique that produces custom groove patterns on the workpiece instead of cutting through the material. It can be applied to piezoelectric ceramics (PZT) for Sonar arrays and other materials for producing waveguides.
Chopper Cut
During the chopper cut, the dicing blade enters the workpiece directly from the top at any selected position and exits along the same axis. There is no contact between dicing blade and the workpiece edge. The chopper cut technique allows for highly flexible dicing processes.
Circle Cut - Wafer Downsizing
The Circle Cut is employed to reduce the diameter of a wafer. By circle cut technique, the dicing blade enters the wafer and the chuck table rotates until a smaller wafer is cut out. If required, a flat can be added at the edge of the wafer to keep the crystal orientation.
Edge trimming (by dicing)
Edge trimming can be performed either by dicing or by grinding. It is effective when it comes to enhancing the edge quality on a wafer that is bonded to a substrate. By edge trimming, the wafer is stabilized and fractures are prevented.
Ultrasonic Dicing
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