22.05.2019 | Events
IMAPS MiNaPAD Grenoble 2019
Get to know our advanced semiconductor wafer and substrate dicing, grinding and processing technology at IMAPS MiNaPAD Grenoble
IMAPS MiNaPAD Grenoble 2019
We offered an inview at our processes and services at our booth at IMAPS MiNaPAD Grenoble 2019 and presented ”Laser lift-off (LLO) and CONDOx for Wafer ultra-thinning process for 3D stacked Devices, TSV, eWLB and WLCSP and DICING WITHOUT Adhesives for MEMS and optical devices.”. Thank you for your big interest during these two days!
Looking forward to meeting you next year!