Grinding (KEZURU) – Grinding thinner than paper

Electronic products are becoming smaller and thinner. This means the electronic components that go into them must become smaller and thinner. With new grinding tools needed more than ever, DISCO’s precision grinding equipment deliver advanced thinning services.

All DGS applications are offered for various materials up to 300 mm in combination with:

  • Wafer lamination
  • Wafer mounting
  • UV irradiation of UV-tapes
  • Inspection (chipping inspection, die strength testing, etc.)
  • Vacuum sealed packaging under N2

Standard Grinding

“Standard Grinding” is a method for grinding wafers in preparation of the dicing process. The wafer passes the rough and precision grinding phases that reduce its thickness as required for further processing. “Standard Grinding“ enables the production of ultra-thin wafers.

Ultra-Thin Grinding

Special processes (handling and tools) that support standard grinding applications for the production of ultra-thin wafers.

Bonded Wafer Grinding

Experience in high-quality “Bonded Wafer Grinding” based on the utilization of appropriate equipment.

Partial Wafer Grinding

Partial Wafer Grinding is an efficient grinding method to process broken or damaged wafers, or wafer sections. This technique can be employed to process wafers that have been damaged, or wafer sections that are still intact, thereby avoiding loss of the entire wafer material.

Individual Die (Chip) Grinding

The term “Individual Die Grinding” refers to the grinding of individual chips. This technique is employed in situations where only specific chips of a wafer have to be ground, or where only individual chips are available instead of complete wafers.

Edge Trimming (by grinding)

When wafers are bonded to a substrate, “Edge Trimming“ represents an efficient method for enhancing edge quality. Grinding stabilizes the wafer and prevents fractures.

Poligrind / Ultrapoligrind

Poligrind, as well as the Ultrapoligrind technology deliver even higher performance, representing the latest developments among the high-grade special wheels for precision grinding. In comparison with the standard grinding process, the technology delivers superior results with ultimate chip stability and excellent post-grinding surface roughness. Thanks to the high grinding quality, subsequent stress relief processing can be discarded.
Surface roughness: Poligrind Ra: 9nm Ultrapoligrind Ra: 4nm