Dicing (KIRU) - Precision Cutting

When something is made, it tends to be roughly formed first, and then cut to the necessary size. As semiconductor technology advances, the ability to cut to the micrometer it is essential in wafer dicing. Whether it’s a dicing machine or laser saw, DISCO’s range of precision tools deliver outstanding cutting capabilities to all types of customer products.

All DGS applications are offered for various materials up to 300 mm in combination with:

  • Wafer lamination
  • Wafer mounting
  • UV irradiation of UV-tapes
  • Inspection (chipping inspection, die strength testing, etc.)
  • Vacuum sealed packaging under N2

Single Cut

A “Single Cut” is executed with only one saw spindle, i.e. the substrate is sectioned with a single cut, whereby the chuck moves along the x axis, while the spindle traverses along the y and z axes.

Step Cut

The “Step Cut” involves the use of two saw spindles. This technique offers distinctive advantages in terms of the substrate processing, i.e. for each spindle different dicing blades and different parameters (e.g. the rpm) ensure a kerf quality of particularly high grade and enhance quality of the backside of the substrate.

Bevel Cut

The “Bevel Cut” is executed using a (V-shaped) dicing blade with smooth corners that reduces the cutting angle and, therefore, sharpness at the die edges which can result in increased die strength.

Grooving

“Grooving” is a dicing technique that is merely deployed to produce custom groove patterns on the workpiece instead of cutting through the material.

Chopper Cut

Using the “Chopper Cut” technique, the dicing blade enters the workpiece directly from the top at any selected position and exits it along the same axis, therefore it is not necessary for the dicing blade to cut through the wafer. This technology allows for extremely flexible dicing processes, e.g. for cutting wafer grooves.

Circle Cut

The “Circle Cut” technique is employed to downsize wafers. The dicing blade contacts the wafer at a specific inner position (e.g. by means of “Chopper Cut”) and the chuck rotates the object until the circular cut has been completed. This technique can also be used to groove flats.

Edge Trimming (by dicing)

“Edge Trimming” is an efficient method that enhances the edge quality on a wafer that is bonded to a substrate. Edge trimming with the dicing blade stabilizes the wafer and prevents fractures.